PRINTED WIRING BOARDS EXPO 2027
NEPCON JAPAN 2027 – the 41st Electronics R&D, Manufacturing and Packaging Technology Expo – runs from 17‑19 February 2027 at Tokyo Big Sight. It targets professionals across the electronics manufacturing spectrum, showcasing categories such as Home Appliances, Personal Computers, Office/Peripheral Equipment, Audio‑Visual, Test & Inspection, Aircraft/Vessel, Optical Instruments, Mobile Communication Systems, Semiconductor Assembly, Industrial Control & Factory Automation, Transportation, Medical Devices and more. The event runs alongside several concurrent specialized expos: INTERNEPCON JAPAN, ELECTROTEST JAPAN, IC SENSOR PACKAGING EXPO, ELECTRONIC COMPONENTS MATERIALS EXPO, PWB EXPO, FINE PROCESS TECHNOLOGY EXPO, Power Device & Module Expo, and EMS & ODM EXPO, providing a comprehensive platform for the entire electronics supply chain.
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Карта мест и отели вокруг
Koto - Tokyo Big Sight, Токио, Япония