InterPACK 2026
InterPACK 2026, held October 26‑29 in San Diego, is the premier ASME conference on electronic and photonic packaging. It showcases a broad spectrum of exhibits and technical sessions covering heterogeneous integration, data‑center and edge computing, Internet of Things, additive and printed electronics, flexible and wearable devices, photonics and optics, power electronics, energy conversion and storage, and automotive electronics for autonomous, hybrid and electric vehicles. The program is organized into tracks such as heterogeneous integration for data centers, modular edge systems, extreme‑environment packaging, RF/power photonics, nanoscale heat transfer, multiscale thermal transport, intelligent modeling and automation, and micro/nano mechatronics. The event combines paper presentations, panels, workshops, tutorials, keynotes, and a joint industry‑academia poster session, fostering collaboration among industry, academia, national labs, and start‑ups.
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Карта мест и отели вокруг
Сан-Диего - DoubleTree by Hilton San Diego - Mission Valley, Калифорния, США