InterPACK 2026 Conference & Exhibition 2026
Интерпакк 2026
The International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems
InterPACK is the leading global forum for research, development, manufacturing, and applications in electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD).
Даты и Место
- Даты:October 26–29, 2026
- Место проведения:San Diego Marriott Mission Valley, 8757 Rio San Diego Drive, San Diego, CA 92108, USA
- Формат:Вживую
Полевые участки
Heterogeneous Integration; Data Center and Modular Edge Systems; Electronic Packaging for Extreme Environments; Power/RF Electronics and Photonics; Nanoscale Heat Transfer and Energy Storage; Flexible, Wearable, and Printed Electronics; Intelligent Modeling and Simulation; Micro/Nano Mechatronics and IoT applications.
Программа
Technical paper presentations, exhibits, panel discussions, workshops, tutorials, keynotes, technology talks, and a joint poster session uniting industry, national labs, and academia.
Официальный сайт
Note: This is ASME InterPACK (electronics/photonic packaging), not Messe Düsseldorf Interpack.
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Карта выставочного центра и отели рядом
Сан-Диего - Сан-Диего Мариотт Миссивалли, Калифорния, США