Electronic Packaging, Electro-Mechanical Solutions & 3D Day 2026
The Electronic Packaging, Electro‑Mechanical Solutions 3D Day is a one‑day (08:30‑15:30) exhibition and conference in Tel‑Aviv (Pavilion 10) aimed at engineers, project managers, manufacturing and procurement professionals. It showcases the latest in electronic packaging interconnect technologies, eco‑friendly server racks, military and commercial automotive packaging, thermal‑management cooling solutions, industrial design, simulation, environmental testing, metal‑plastic machining and fastener standardisation. Expert‑led sessions cover smart packaging materials and coatings, rapid‑prototype 3D printing, EMC/EMI/RFI compliance and custom packaging for extreme conditions. The event offers free admission with prior registration, providing networking and business opportunities with leading manufacturers and solution providers.
Регистрация для входа или кабины
Карта мест и отели вокруг
Тель-Авив-Яфо - Тель-Авивский конференц-центр, Тель-Авивский район, Израиль