Advanced Packaging and Chiplet Summit 2026
The APCS 2026 exhibition area gathers leading semiconductor packaging and chiplet companies to showcase cutting‑edge technologies and solutions. Adjacent to it, the ADIS (Advanced Design Innovation Summit) exhibition focuses on design and verification tools. The show also includes dedicated Technology Pavilions and Regional Pavilions that group exhibitors by specialty or geography, plus SEMICON PATHS for ecosystem partners. Concurrent SEMI events—Metrology & Inspection Summit, Workforce Development, SEMICON STADIUM, and others—enhance the overall offering. Invitation‑only ADIS networking sessions provide cross‑disciplinary connection opportunities among exhibitors, speakers, and committee members.
Регистрация для входа или кабины
Карта мест и отели вокруг
Koto - Tokyo Big Sight, Токио, Япония